Ardebili, Haleh (Department of Mechanical Engineering, University of Houston, USA and visiting scholar, Mechanical Engineering and Materials Science Department, Rice University)
Encapsulation Technologies for Electronic Applications - Materials and Processes for Electronic Applications Ardebili, Haleh (Department of Mechanical Engineering, University of Houston, USA and visiting scholar, Mechanical Engineering and Materials Science Department, Rice University) 2.º edición

Name: Encapsulation Technologies for Electronic Applications - Materials and Processes for Electronic Applications
Price: 4826 MXN
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Author: Ardebili, Haleh (Department of Mechanical Engineering, University of Houston, USA and visiting scholar, Mechanical Engineering and Materials Science Department, Rice University)

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Encapsulation Technologies for Electronic Applications - Materials and Processes for Electronic Applications

Ardebili, Haleh (Department of Mechanical Engineering, University of Houston, USA and visiting scholar, Mechanical Engineering and Materials Science Department, Rice University)

2.º edición

498 pages

Medios de comunicación	Libros Paperback Book (Libro con tapa blanda y lomo encolado)
Publicado	11 de octubre de 2018
ISBN13	9780128119785
Editores	William Andrew Publishing
Páginas	508
Dimensiones	151 × 229 × 24 mm · 675 g
Lengua	Inglés
Editor de series	Licari, James J. (AvanTeco, Whittier, CA, USA)