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Rapid Thermal Processing for Future Semiconductor Devices Fukuda, H. (Muroran Institute of Technology, Department of Electrical and Electronic Engineering, Mizumoto-cho, Muroran, Hokkaido, Japan)
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Rapid Thermal Processing for Future Semiconductor Devices
Fukuda, H. (Muroran Institute of Technology, Department of Electrical and Electronic Engineering, Mizumoto-cho, Muroran, Hokkaido, Japan)
A collection of papers which were presented at the 2001 International Conference on Rapid Thermal Processing (RTP 2001) held at Ise Shima, Mie, on November 14-16, 2001. It covers the following areas such as advanced MOS gate stack, integration technologies, advancd channel engineering including shallow junction, SiGe and hetero-structure.
160 pages
| Medios de comunicación | Libros Paperback Book (Libro con tapa blanda y lomo encolado) |
| Publicado | 2 de abril de 2003 |
| ISBN13 | 9780444513397 |
| Editores | Elsevier Science & Technology |
| Páginas | 160 |
| Dimensiones | 172 × 243 × 17 mm · 240 g |
