Recomienda este artículo a tus amigos:
THERMAL MANAGEMENT OF MICROELECTRONIC EQUIPMENT (801683) - ASME Press Series on Electronic Packaging Lian-tuu Yeh
¿Tienes un perfil? Iniciar sesión
Recibe notificaciones sobre nuevos lanzamientos de Lian-tuu Yeh
Añadir a tu lista de deseos de iMusic
THERMAL MANAGEMENT OF MICROELECTRONIC EQUIPMENT (801683) - ASME Press Series on Electronic Packaging
Lian-tuu Yeh
With this systematic examination of the factors that govern the thermal performance of electronics, the authors solve design problems encountered in developing and analysing very-high-performance and high-heat-dissipation devices, as well as intermediate and lower-power devices.
440 pages
| Medios de comunicación | Libros Paperback Book (Libro con tapa blanda y lomo encolado) |
| Publicado | 2002 |
| ISBN13 | 9780791801680 |
| Editores | American Society of Mechanical Engineers |
| Páginas | 440 |
| Dimensiones | 241 × 162 × 31 mm · 793 g |