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The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages Gerard Kelly 1999 edition
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The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
Gerard Kelly
One of the greatest challenges facing package manufacturers is to develop reliable fine pitch thin packages with high leadcounts, capable of dissipating heat, and deliver them in volume to the market in a very short space of time.
134 pages, biography
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