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Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume I Materials Physics - Materials Mechanics. Volume II Physical Design - Reliability and Packaging Softcover reprint of the original 1st ed. 2007 edition
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume I Materials Physics - Materials Mechanics. Volume II Physical Design - Reliability and Packaging
This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials.
1460 pages, LXII, 1460 p. In 2 volumes, not available separately.
| Medios de comunicación | Libros Paperback Book (Libro con tapa blanda y lomo encolado) |
| Publicado | 23 de agosto de 2016 |
| ISBN13 | 9781489978851 |
| Editores | Springer-Verlag New York Inc. |
| Páginas | 1460 |
| Dimensiones | 150 × 220 × 10 mm · 2,82 kg |
| Lengua | Inglés |
| Editor | Lee, Y.C. |
| Editor | Suhir, Ephraim |
| Editor | Wong, C.P. |