C P Wong

Nano-Bio- Electronic, Photonic and MEMS Packaging C P Wong 2010 edition

Marc Notes: Title from content provider.; Access is restricted to subscribing institutions. Jacket Description/Back: Nanotechnologies are frequently being applied to the biotechnology area, especially in nano material synthesis. Until recently, there has been little research into how to implement nano/bio materials at the device level. Nano-Bio- Electronic, Photonic and MEMS Packaging discusses how nanofabrication techniques can be used to customize packaging for nano devices with applications to biological and biomedical research and products. Covering such topics as nano bio sensing electronics, bio device packaging, NEMs for bio devices and much more, including: Offering a comprehensive overview of nano and bio packaging Discussing nano materials as power energy sources Analyzing nanotubes, superhydrophobic self-clean Lotus surfaces Covering nano chemistry for bio sensor / bio medical device packagingNano-Bio- Electronic, Photonic and MEMS Packaging is the perfect book for all biomedical engineers, industrial electronics packaging engineers, and those engaged in bio nanotechnology applications research. Table of Contents: Nanomaterials for Microelectronic and Bio-packaging.- Nano-conductive Adhesives for Nano-electronics Interconnection.- Biomimetic Lotus Effect Surfaces for Nanopackaging.- Applications of Carbon Nanomaterials as Electrical Interconnects and Thermal Interface Materials.- Nanomaterials via NanoSpray Combustion Chemical Vapor Condensation, and Their Electronic Applications.- 1D Nanowire Electrode Materials for Power Sources of Microelectronics.- Mechanical Energy Harvesting Using Wurtzite Nanowires.- Nanolead-Free Solder Pastes for Low Processing Temperature Interconnect Applications in Microelectronic Packaging.- to Nanoparticle-Based Integrated Passives.- Thermally Conductive Nanocomposites.- Physical Properties and Mechanical Behavior of Carbon Nano-tubes (CNTs) and Carbon Nano-fibers (CNFs) as Thermal Interface Materials (TIMs) for High-Power Integrated Circuit (IC) Packages: Review and Extension.- On-Chip Thermal Management and Hot-Spot Remediation.- Some Aspects of Microchannel Heat Transfer.- Nanoprobes for Live-Cell Gene Detection.- Packaging for Bio-micro-electro-mechanical Systems (BioMEMS) and Microfluidic Chips.- Packaging of Biomolecular and Chemical Microsensors.- Nanobiosensing Electronics and Nanochemistry for Biosensor Packaging.- Molecular Dynamics Applications in Packaging.- Nanoscale Deformation and Strain Analysis by AFM/DIC Technique.- Nano-Scale and Atomistic-Scale Modeling of Advanced Materials. Publisher Marketing: Nanotechnologies are being applied to the biotechnology area, especially in the area of nano material synthesis. Until recently, there has been little research into how to implement nano/bio materials into the device level. Nano and Bio Electronics Packaging discusses how nanofabrication techniques can be used to customize packaging for nano devices with applications to biological and biomedical research and products. Covering such topics as nano bio sensing electronics, bio device packaging, NEMs for Bio Devices and much more."

Contributor Bio:  Wong, C P C. P. Wong is a Regents' Professor (the highest ranking distinguished Professor at Georgia Tech) at the School of Materials Science and Engineering and a Research Director at the NSF Packaging Research Center at Georgia Institute of Technology. He received his B. S. degree in chemistry from Purdue University, and his Ph. D. degree in chemistry from Pennsylvania State University. Thereafter, he was awarded a two-year Postdoctoral Fellowship at Stanford University with Nobel Laureate Prof. Henry Taube. Dr. Wong spent 19 years at AT&T Bell Labs and was elected as a Bell Labs Fellow(the most prestigious Award bestowed by AT&T Bell Labs) in 1992. His research interests lie in the fields of polymeric materials, reaction mechanism, IC encapsulation, in particular, hermetic equivalent plastic packaging, electronic packaging processes, interfacial adhesions, PWB, SMT assembly and component reliability. He received many awards, among those, the AT&T Bell Laboratories Distinguished Technical Staff Award in 1987, the AT&T Bell Labs Fellow Award in 1992, the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society Outstanding and Best Paper Awards in 1990, 1991, 1994, 1996 and 1998, the IEEE Technical Activities Board Distinguished Award in 1994, the 1995 IEEE CPMT Society's Outstanding Sustained Technical Contribution Award, the 1999 Georgia Tech's Outstanding Faculty Research Program Development Award, the 1999 NSF-Packaging Research Center Faculty of the Year Award, the Georgia Tech Sigma Xi Faculty Best Research Paper Award in 2000 and the University Press (London, UK) Award of Excellence in 2000. He holds over 45 U. S. patents, numerous international patents, and over 270 technical papers in the related area. For the past five years since joining Georgia Tech, he has been a Research Director at the world renowned NSF electronic Packaging Center. Leading a team of 32 faculty from six departments and 270 graduate students from Georgia Tech. Besides, he also works with over sixty United States, Japan, and European major semiconductor companies providing a leadership role in technology transfer. Dr. Wong was elected a member of the National Academy of Engineering in 2000, and he is a Fellow of the IEEE, AIC and AT&T Bell Labs, and was the general chairman of the IEEE/EIA 41st Electronic Components and Technology Conference in 1991. He served as the technical vice president (1990 & 1991), and the president (1992 & 1993) of the IEEE-CPMT Society, member of the IEEE TAB management committee in 1993-94, chair of the IEEE TAB Design and Manufacturing Engineering in 1995-97 and the IEEE Nomination and Appointment committee in 1996-97.