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System-in-Package: Electrical and Layout Perspectives - Foundations and Trends (R) in Electronic Design Automation Lei He
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System-in-Package: Electrical and Layout Perspectives - Foundations and Trends (R) in Electronic Design Automation
Lei He
Focuses on electrical and layout perspectives, as opposed to discussing thermal and mechanic characteristics of System-in-Package (SiP). The book first introduces package technologies, and then presents SiP design flow and design exploration. Finally, it discusses details of beyond-die signal and power integrity and physical implementation.
94 pages
| Medios de comunicación | Libros Paperback Book (Libro con tapa blanda y lomo encolado) |
| Publicado | 30 de junio de 2011 |
| ISBN13 | 9781601984586 |
| Editores | now publishers Inc |
| Páginas | 94 |
| Dimensiones | 156 × 234 × 5 mm · 145 g |
| Lengua | Inglés |
