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Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging - Materials, Circuits and Devices Zhang, Shuye (Associate Professor, Harbin Institute of Technology, China)
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Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging - Materials, Circuits and Devices
Zhang, Shuye (Associate Professor, Harbin Institute of Technology, China)
There is a growing demand for more accurate simulation techniques to address the thermomechanical challenges faced in advanced electronic packaging. This book compiles the latest advancements in thermomechanical simulation methodologies, empowering readers with the knowledge to help optimize electronic package designs.
| Medios de comunicación | Libros Hardcover Book (Libro con lomo y cubierta duros) |
| Publicado | 1 de julio de 2025 |
| ISBN13 | 9781837241408 |
| Editores | Institution of Engineering and Technolog |
| Páginas | 199 |
| Dimensiones | 150 × 220 × 20 mm · 462 g |
