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Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method - Springer Series in Advanced Manufacturing Seonho Seok 2018 edition
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Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method - Springer Series in Advanced Manufacturing
Seonho Seok
115 pages, 106 Illustrations, black and white; VIII, 115 p. 106 illus.
| Medios de comunicación | Libros Hardcover Book (Libro con lomo y cubierta duros) |
| Publicado | 14 de mayo de 2018 |
| ISBN13 | 9783319778716 |
| Editores | Springer International Publishing AG |
| Páginas | 115 |
| Dimensiones | 150 × 220 × 20 mm · 353 g |
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