3D Microelectronic Packaging: From Fundamentals to Applications - Springer Series in Advanced Microelectronics -  - Libros - Springer International Publishing AG - 9783319830865 - 13 de julio de 2018
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3D Microelectronic Packaging: From Fundamentals to Applications - Springer Series in Advanced Microelectronics Softcover reprint of the original 1st ed. 2017 edition

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This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages.


463 pages, 253 Illustrations, color; 78 Illustrations, black and white; IX, 463 p. 331 illus., 253 i

Medios de comunicación Libros     Paperback Book   (Libro con tapa blanda y lomo encolado)
Publicado 13 de julio de 2018
ISBN13 9783319830865
Editores Springer International Publishing AG
Páginas 463
Dimensiones 150 × 220 × 10 mm   ·   662 g
Lengua Alemán  
Editor Goyal, Deepak
Editor Li, Yan

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