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Materials for Advanced Packaging C.P. Wong-Daniel Lu Softcover reprint of the original 2nd ed. 2017 edition
Materials for Advanced Packaging
C.P. Wong-Daniel Lu
Original chapters on bonding and joining techniques, nanopackaging and biomedical packaging, MEMS and wafer level chip scale packaging, and packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives have all been updated with the latest developments in the field.
969 pages, 434 Tables, color; 85 Tables, black and white; 440 Illustrations, color; 260 Illustration
| Medios de comunicación | Libros Paperback Book (Libro con tapa blanda y lomo encolado) |
| Publicado | 8 de junio de 2018 |
| ISBN13 | 9783319832098 |
| Editores | Springer International Publishing AG |
| Páginas | 969 |
| Dimensiones | 234 × 157 × 55 mm · 1,49 kg |
| Lengua | Alemán |
| Editor | Lu, Daniel |
| Editor | Wong, C.P. |