Interfacial Energy for Oraganosilane Tailored Copper-silica Interface: Delamination Nanomechanics and Energy Partition into Adhesion and Plasticity - Ashutosh Jain - Libros - LAP LAMBERT Academic Publishing - 9783843373906 - 16 de noviembre de 2010
En caso de que portada y título no coincidan, el título será el correcto

Interfacial Energy for Oraganosilane Tailored Copper-silica Interface: Delamination Nanomechanics and Energy Partition into Adhesion and Plasticity

Precio
Mex$ 961
sin IVA

Pedido desde almacén remoto

Entrega prevista 5 - 17 de ago.
Recibe notificaciones sobre nuevos lanzamientos de Ashutosh Jain
Añadir a tu lista de deseos de iMusic

Aún no valorado

The partitioning of interface fracture energy into bond breaking energy and plastic energy in ductile layer(s) constituting the interface is a central problem in fracture mechanics. A new approach to partition the fracture energy of a metal-ceramic interface into work of adhesion and plasticity is introduced, unveiling the nanomechanics of interfacial deformation and fracture. The crack path uncertainties are obviated by constraining fracture to occur in an interfacial molecular layer through fissure of a single bond type whose strength is varied by adjusting the chemical environment. This approach is adaptable for studying interfacial fracture and related phenomena in diverse materials systems in different thermochemical environments.

Medios de comunicación Libros     Paperback Book   (Libro con tapa blanda y lomo encolado)
Publicado 16 de noviembre de 2010
ISBN13 9783843373906
Editores LAP LAMBERT Academic Publishing
Páginas 124
Dimensiones 226 × 7 × 150 mm   ·   203 g
Lengua Alemán  

Mas por Ashutosh Jain

Mostrar todo