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Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments - Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems Juan Cepeda-Rizo
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Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments - Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems
Juan Cepeda-Rizo
This book provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for design spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars.
290 pages, 70 Tables, black and white; 188 Line drawings, black and white; 29 Halftones, black and w
| Medios de comunicación | Libros Paperback Book (Libro con tapa blanda y lomo encolado) |
| Publicado | 26 de agosto de 2024 |
| ISBN13 | 9781032160856 |
| Editores | Taylor & Francis Ltd |
| Páginas | 290 |
| Dimensiones | 157 × 233 × 21 mm · 470 g |
| Lengua | Inglés |
