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Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments - Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems Juan Cepeda-Rizo 2.º edición
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Mex$ 2.291
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Entrega prevista 7 - 12 de ene. de 2027
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Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments - Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems
Juan Cepeda-Rizo
Suitable for practicing professionals as well as upper-level students in the areas of aerospace, mechanical, thermal, electrical, and systems engineering, Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments has cutting-edge information on how to design, analyze, and test in the small satellite environment.
| Medios de comunicación | Libros Hardcover Book (Libro con lomo y cubierta duros) |
| Pendiente de lanzamiento | 30 de diciembre de 2026 |
| ISBN13 | 9781041216919 |
| Editores | Taylor & Francis Ltd |
| Páginas | 304 |
| Dimensiones | 150 × 220 × 20 mm · 490 g (Peso (estimado)) |
