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Elements of Electromigration: Electromigration in 3D IC technology Tu, King-Ning (City University of Hong Kong)
Elements of Electromigration: Electromigration in 3D IC technology
Tu, King-Ning (City University of Hong Kong)
In this invaluable resource for graduate students and practicing professionals, Tu and Liu provide a comprehensive account of electromigration and give a practical guide on how to manage its effects in microelectronic devices, especially newer devices that make use of 3D architectures.
| Medios de comunicación | Libros Paperback Book (Libro con tapa blanda y lomo encolado) |
| Publicado | 25 de diciembre de 2025 |
| ISBN13 | 9781032470283 |
| Editores | Taylor & Francis Ltd |
| Páginas | 132 |
| Dimensiones | 150 × 220 × 10 mm · 260 g |
| Lengua | Inglés |